XCVM1502-1MLIVSVA2197 System On Chip (SoC)_Huizhong Dingtai_Passive Components_Memory Memory_Data Memory_Wires&Cables_Circuit Protection_Power Supply_Semiconductors_Optoelectronic Products_Sensors

XCVM1502-1MLIVSVA2197

IC VERSALPRIME ACAP FPGA 2197BGA

Product parameters

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TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ Prime
Package	Tray
Product Status	ACTIVE
Package / Case	2197-BFBGA, FCBGA
Speed	600MHz, 1.3GHz
RAM Size	256KB
Number of I/O	608
Operating Temperature	-40°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ Prime FPGA, 1M Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	2197-FCBGA (45x45)
Architecture	MPU, FPGA