WS991LT35T4
| ： | WS991LT35T4 |
|---|---|
| ： | Solder |
| ： | Chip Quik, Inc. |
| ： | THERMALLY STABL |
| ： | - |
| ： | Bulk |
| ： | 1 |
| TYPE | DESCRIPTION |
| Mfr | Chip Quik, Inc. |
| Series | CHIPQUIK® |
| Package | Bulk |
| Product Status | ACTIVE |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Type | Solder Paste |
| Melting Point | 280°F (138°C) |
| Form | Syringe, 1.23 oz (34.869g) |
| Mesh Type | 4 |
| Flux Type | Water Soluble |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
| Shelf Life Start | Date of Manufacture |
| Shelf Life | 12 Months |
