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WS991LT35T4

THERMALLY STABLE SOLDER PASTE WS

Product parameters

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TYPE	DESCRIPTION
Mfr	Chip Quik, Inc.
Series	CHIPQUIK®
Package	Bulk
Product Status	ACTIVE
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type	Solder Paste
Melting Point	280°F (138°C)
Form	Syringe, 1.23 oz (34.869g)
Mesh Type	4
Flux Type	Water Soluble
Storage/Refrigeration Temperature	37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start	Date of Manufacture
Shelf Life	12 Months

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