: | JET551AX30T5 |
---|---|
: | Solder |
: | Chip Quik, Inc. |
: | JET PRINTING SO |
: | - |
: | Bulk |
: | 1 |
TYPE | DESCRIPTION |
Mfr | Chip Quik, Inc. |
Series | CHIPQUIK® |
Package | Bulk |
Product Status | ACTIVE |
Composition | Sn63Pb37 (63/37) |
Type | Solder Paste |
Melting Point | 361°F (183°C) |
Form | Syringe, 3.53 oz (100g) |
Process | Leaded |
Flux Type | No-Clean |
Shelf Life Start | Date of Manufacture |
Shelf Life | 12 Months |